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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Kyocera Corp.MagnaChip Semiconductor Ltd.International Rectifier Corp.KEC Corp.Akustica, Inc.Excelliance MOS Corp.Silicon Optronics, Inc.Capteur Sensors & Analysers Ltd.Advanced Power Electronics Corp.Advanced Power Electronics Corp.AltaSens, Inc.Suzhou Tongguan Microelectronics Co., Ltd.Suzhou Tongguan Microelectronics Co., Ltd.Sensovation AGImagerlabs, Inc.WiLinx Corp.AIRY3D, Inc.Silicon Semiconductor Corp.Cambrius, Inc.LeFram Technology Corp.Maxtek Technology Co. Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Intel Corp.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.
Spirea ABSpirea ABSiBEAM, Inc.WiLinx Corp.Consystant Design Technologies, Inc.
telent Ltd.Taiyo Yuden Co., Ltd.Advanced International Multitech Co. Ltd.Insta GmbHTime Domain Corp.Haystack Technologies, Inc.Sharpen Info TechMojix, Inc.KERLINK SADecaWave Ltd.AeroScout LLCXtremeSpectrum, Inc.Traxens SASAfimilk - Agricultural Cooperative Ltd.Artimi Ltd.Alereon, Inc.Holux Technology, Inc.Geeya Technology Co., Ltd.Red Point Positioning Corp.Halfwave ASSigma Designs, Inc.WISER Systems, Inc.Polte Corp.5d Robotics, Inc.Wisair Ltd.Wisair Ltd.KLATU Networks, Inc.GiPSTech SRLFleet Space Technologies Pty Ltd.Physical Devices, Inc.
NIPPON STEEL Stainless Steel Corp.Kobe Steel, Ltd.IG Farbenindustrie AGAmerican Can Co.Suzuki Co., Ltd.American Can Co.Sumitomo Metal Industries Ltd.Hitachi Metals, Ltd.Proterial Ltd.Hitachi Construction Machinery Co., Ltd.Hitachi Cable Ltd.YKK Corp.YKK Corp.Nissan Chemical Corp.Sumitomo Metal Mining Co. Ltd.Daido Steel Co., Ltd.Mitsui Mining & Smelting Co., Ltd.Toyo Seikan Group Holdings Ltd.JX Nippon Mining & Metals Corp.Baoshan Iron & Steel Co., Ltd.Konami Digital Entertainment Co., Ltd.Baoshan Iron & Steel Co., Ltd.NIPPON STEEL Stainless Steel Corp.Nippon Light Metal Co., Ltd.Sintokogio Ltd.Nippon Micrometal Corp.Kennametal, Inc.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Toyo Ink SC Holdings Co. Ltd.
Hon Hai Precision Industry Co., Ltd.Sonos, Inc.Nordic Semiconductor ASAJMA LLCEnOcean GmbHVIZIO, Inc.Taoglas Ltd.Espressif Systems (Shanghai) Co., Ltd.Espressif Systems (Shanghai) Co., Ltd.Newracom, Inc.Queclink Wireless Solutions Co., Ltd.RF Monolithics, Inc.Queclink Wireless Solutions Co., Ltd.Arlo Technologies, Inc.Sequans Communications SAEagleView Technologies, Inc.Option NVON Semiconductor Connectivity Solutions, Inc.Wirepas OyNEXCOM International Co., Ltd.Merrimac Industries, Inc.ETS-Lindgren, Inc.GainSpan Corp.Newport Media, Inc.Pepex Biomedical, Inc.Artimi Ltd.Synapse Wireless, Inc.Forkbeard TechnologiesSource Photonics, Inc.iDevices LLC