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Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Fraunhofer-Gesellschaft eVSamsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.
Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.NTT DOCOMO, Inc.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyMediaTek, Inc.BT Group PlcChina Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.SZ DJI Technology Co., Ltd.telent Ltd.Mannesmann AGSK Telecom Co., Ltd.BlackBerry Ltd.Xiaomi Corp.Nubia Technology Co., Ltd.KDDI Corp.China United Network Communications Ltd.Beijing University of Posts & TelecommunicationsMotorola Solutions Credit Co. LLCGuangzhou Shiyuan Electronic Technology Co. Ltd.Guangzhou Shiyuan Electronic Technology Co. Ltd.Deutsche Telekom AGHangzhou H3C Technologies Co., Ltd.China Telecom Corp. Ltd.Xilinx, Inc.
Hitachi Ltd.LG Electronics, Inc.Toyota Motor Corp.Fujitsu Ltd.General Electric Co.General Electric Co.Ericsson, Inc.Intel Corp.Apple, Inc.Boe Innovation Investment Co. Ltd.Google LLCHoneywell International, Inc.Xerox Holdings Corp.Bayerische Motoren Werke AGAlcatel-Lucent S ANTT DOCOMO, Inc.Renesas Electronics Corp.Dow Global Technologies LLCMicrosoft Corp.AUDI AGToshiba Lighting & Technology Corp.Toyoda Gosei Co., Ltd.Toshiba Lighting & Technology Corp.Hilti AGMediaTek, Inc.Aisin AW Co., Ltd.Boston Scientific Scimed, Inc.Advanced Micro Devices, Inc.Azbil Corp.Meta Platforms, Inc.
Fujitsu Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.South China University of TechnologyMediaTek, Inc.Advantest Corp.Toyota Central R&D Labs, Inc.Nanjing University of Posts & TelecommunicationsSocionext, Inc.Shinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Fujitsu Semiconductor Ltd.DB HITEK Co., Ltd.Advanced Semiconductor Engineering, Inc.EPISTAR Corp.Novatek Microelectronics Corp.Synopsys, Inc.Dowa Electronics Materials Co., Ltd.Rambus, Inc.HRL Laboratories LLCKIOXIA Corp.Canon Anelva Corp.Siliconware Precision Industries Co., Ltd.Power Integrations, Inc.International Rectifier Corp.STATS ChipPAC Pte Ltd.Nagoya Institute of TechnologyChipMOS Technologies, Inc.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.
DB HITEK Co., Ltd.Novatek Microelectronics Corp.LX Semicon Co., Ltd.Faraday Technology Corp.TongFu Microelectronics Co., Ltd.Sitronix Technology Corp.BitMain Technologies Holding Co.Lasertec Corp.Amkor Technology, Inc.BitMain Technologies Holding Co.Walton Advanced Engineering, Inc.Lingsen Precision Industries Ltd.Cavendish Kinetics, Inc.Canaan Creative Co., Ltd.HiSilicon Technologies Co., Ltd.Andes Technology Corp.Shanghai Huahong Group Co., Ltd.United Semiconductor (Xiamen) Co., Ltd.Groq, Inc.United Semiconductor (Xiamen) Co., Ltd.Applied Micro Circuits Corp.Canaan, Inc.Digital Media Professionals Inc.Celis Semiconductor Corp.Advanced Digital Chips, Inc.Standing Egg, Inc.sureCore Ltd.Kneron, Inc.Airmems SASBaum Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Sumitomo Electric Industries Ltd.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Oki Electric Industry Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Micron Technology, Inc.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Resonac Corp.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.
Murata Manufacturing Co. Ltd.MediaTek, Inc.Motorola Mobility LLCHosiden Corp.Opple Lighting Co., Ltd.OSRAM SYLVANIA, Inc.EGLO Leuchten GmbHProMOS Technologies, Inc.Widex A/SWidex A/SPlantronics, Inc.Bang & Olufsen A/SAnker Innovations Technology Co., Ltd.Anker Innovations Technology Co., Ltd.Nordic Semiconductor ASAAnoto ABShure, Inc.D&M Holdings, Inc.DEXIN Corp.Waltop International Corp.Coocaa Network Technology Co. Ltd.Shenzhen C&D Electronics Co., Ltd.Shenzhen Highstar Electrical Appliances Co., Ltd.Stripe, Inc.Scosche Industries, Inc.Topower Co., Ltd.Philips (China) Investment Co., Ltd.DSE Co., Ltd.DSE Co., Ltd.Blackhawk Network, Inc.