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Xerox Holdings Corp.Toshiba Tec Corp.Avery Dennison Corp.Symbol Technologies, Inc.TomTom International BVPHC Holdings Corp.Miwa Lock Co., Ltd.Star Micronics Co., Ltd.Shandong New Beiyang Information Technology Co., Ltd.Zebra Technologies Corp.Shandong New Beiyang Information Technology Co., Ltd.Siemens AG ÖsterreichProMOS Technologies, Inc.Indesit Company SpAKYOCERA AVX Components Corp.Harada Industry Co., Ltd.pSemi Corp.Marchesini Group SpABinder GmbHLeica Biosystems Nussloch GmbHKESPION Co., Ltd.Shenzhen Genvict Technologies Co., Ltd.LitePoint Corp.Uhlmann Pac-Systeme GmbH & Co. KGKrber AGKrber AGArizon RFID Technology Co., Ltd.ZIH Corp.Tsinghua Tongfang Co., Ltd.PolyIC GmbH & Co. KG
Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
NIPPON STEEL Stainless Steel Corp.Kobe Steel, Ltd.IG Farbenindustrie AGAmerican Can Co.Suzuki Co., Ltd.American Can Co.Sumitomo Metal Industries Ltd.Hitachi Metals, Ltd.Proterial Ltd.Hitachi Construction Machinery Co., Ltd.Hitachi Cable Ltd.YKK Corp.YKK Corp.Nissan Chemical Corp.Sumitomo Metal Mining Co. Ltd.PPG Industries Ohio, Inc.JX Nippon Mining & Metals Corp.Daido Steel Co., Ltd.Johnson Matthey PlcToyo Seikan Group Holdings Ltd.JX Nippon Mining & Metals Corp.Baoshan Iron & Steel Co., Ltd.Baoshan Iron & Steel Co., Ltd.Maxell Ltd.NIPPON STEEL Stainless Steel Corp.Nippon Light Metal Co., Ltd.Sintokogio Ltd.Nippon Micrometal Corp.Kennametal, Inc.Shinko Electric Industries Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University