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ASM NEXX, Inc.Highlight Tech System Corp.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Nitto Electric Industrial Co. Ltd.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.
Chi Mei Optoelectronics Corp.Renesas Technology Corp.NXP USA, Inc.NEC Electronics Corp.Hyundai MicroElectronics Co., Ltd.JEOL Ltd.Dongbu Electronics Co. Ltd.FCI SAHitachi Displays Ltd.Elpida Memory, Inc.Thomas & Betts Ltd.Yungu (Gu'an) Technology Co., Ltd.Prime View International Co. Ltd.Optrex Corp.Shanghai Huali Integrated Circuit Manufacturing Co., Ltd.Micronas GmbHShanghai Huali Integrated Circuit Manufacturing Co., Ltd.Kawasaki Microelectronics, Inc.Sharp NEC Display Solutions, Ltd.Zgmicro Wuxi Co. Ltd.Sharp NEC Display Solutions, Ltd.Fositek Corp.JAPAN ELECTRONIC MATERIALS CORP.JAPAN ELECTRONIC MATERIALS CORP.FCI Americas Technology LLCChangzhou Borui Power Automation Equipment Co., Ltd.Furukawa Electric North America, Inc.Xiamen San'an Optoelectronics Co., Ltd.Triple Win Technology Shenzhen Co. Ltd.General Semiconductor, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.BOE Technology Group Co., Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Taiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Samsung Electro-Mechanics Co., Ltd.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Yamaha Corp.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.Sumitomo Metal Industries Ltd.Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.NXP Semiconductors (Thailand) Co., Ltd.NGK SPARK PLUG CO., LTD.NXP BVTCL China Star Optoelectronics Technology Co., Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of TechnologySoutheast University
Sumitomo Heavy Industries, Ltd.Forschungszentrum Jülich GmbHTaiyo Holdings Co., Ltd.Hypertherm Associates, Inc.Ecole PolytechniqueWONIK HOLDINGS CO., LTD.Koike Sanso Kogyo Co., Ltd.Haemonetics Corp.The Lincoln Electric Co.Nippon Steel Welding & Engineering Co., Ltd.TOCALO Co., Ltd.VON ARDENNE GmbHThe ESAB Group, Inc.Yantai Longyuan Power Technology Co., Ltd.TAE Technologies, Inc.SPTS Technologies Ltd.Université de LimogesLG Electronics (Nanjing) Plasma Co. Ltd.Tokamak Energy Ltd.P2i Ltd.NEW POWER PLASMA Co., Ltd.Ceravision Ltd.LFB Biotechnologies SASUAlenia Aermacchi SpAJCU Corp.TRUMPF Hüttinger GmbH + Co. KGSilicon Genesis Corp.Charm Engineering Co., Ltd.DAWONSYS Co., Ltd.SAMCO, Inc.