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Tencent Technology (Shenzhen) Co., Ltd.Hewlett Packard Enterprise Development LPHeidelberger Druckmaschinen AGPraxair S.T. Technology, Inc.China Telecom Corp. Ltd.Dolby International ABUnisys Corp.Tata Consultancy Services Ltd.Hitachi Software Engineering Co., Ltd.Hitachi Software Engineering Co., Ltd.NEC Soft Ltd.SAMSUNG SDS CO., LTD.The Nielsen Company (US) LLCWINCOR NIXDORF International GmbHCanon IT Solutions, Inc.NTT DATA Corp.Giesecke+Devrient Mobile Security GmbHToshiba Digital Solutions Corp.Vtron Group Co., Ltd.3D Systems, Inc.FoxboroZhejiang Geely Commercial Vehicles Group Co. Ltd.NTT Communications Corp.Visa U.S.A., Inc.Veritas Technologies LLCCOLOPL, Inc.Uchida Yoko Co., Ltd.NEC Personal Computers Ltd.Alto SARLBeijing Topsec Network Security Technology Co. Ltd.
Samsung Electronics Co., Ltd.Canon, Inc.Hitachi Ltd.Fujitsu Ltd.Sharp Corp.SANYO Electric Co., Ltd.Intel Corp.Sumitomo Electric Industries Ltd.Sumitomo Chemical Co., Ltd.BOE Technology Group Co., Ltd.Boe Innovation Investment Co. Ltd.KYOCERA Chemical Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fuji Electronics Co., Ltd.Nikon Corp.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Semiconductor Energy Laboratory Co., Ltd.Guangzhou Bosma Optoelectronic Technology Co. Ltd.Toppan, Inc.Samsung Electro-Mechanics Co., Ltd.AGC, Inc. (Japan)ABB Automation, Inc.Renesas Electronics Corp.Shin-Etsu Chemical Co., Ltd.Alps Alpine Co., Ltd.Suzuki Co., Ltd.Showa Denko Materials Co. Ltd.South China University of Technology
Nichia Corp.Fujitsu Semiconductor Ltd.Skyworks Solutions, Inc.Dowa Electronics Materials Co., Ltd.Novuton Technology Corp. JapanSumitomo Electric Device Innovations, Inc.GlobalWafers Co., Ltd.MACOM Technology Solutions Holdings, Inc.NTT Advanced Technology Corp.Hitachi Power Semiconductor Device Ltd.RichWave Technology Corp.Xiamen Changelight Co., Ltd.Ampleon Netherlands BVXiamen San'an Integrated Circuit Co., Ltd.Win Semiconductors Corp.Freiberger Compound Materials GmbHEfficient Power Conversion Corp.Transphorm Technology, Inc.Shanghai Simgui Technology Co., Ltd.Shanghai Simgui Technology Co., Ltd.United Monolithic Semiconductors SASDenseLight Semiconductors Pte Ltd.Mercury Systems, Inc.AXT, Inc.United Silicon Carbide, Inc.Necsel Intellectual Property, Inc.Next Generation Power Systems, Inc.Exagan SAGaN Systems, Inc.Scientific Components Corp.
Xiamen San'an Integrated Circuit Co., Ltd.EpiValley Co., Ltd.Efficient Power Conversion Corp.Transphorm Technology, Inc.Formosa Epitaxy, Inc.Focus Lightings Tech Co., Ltd.AZZURRO Semiconductors AGExagan SAGaN Systems, Inc.VisIC Technologies Ltd.Epinovatech ABPoro Technologies Ltd.Nitronex LLCAkash Systems, Inc.Sinmat Commercial LLCHexagem ABCrystal Photonics, Inc.iBeam Materials, Inc.mLED Ltd.Group4 Labs, Inc.Technologies & Devices International, Inc.
Fraunhofer-Gesellschaft eVSouth China University of TechnologyUniversity of Electronic Science & Technology of ChinaToyota Central R&D Labs, Inc.Hangzhou Dianzi UniversityDowa Electronics Materials Co., Ltd.Arizona State UniversityHRL Laboratories LLCRichtek Technology Corp.Power Integrations, Inc.International Rectifier Corp.Nuvoton Technology Corp.SNU Precision Co., Ltd.Xiamen San'an Integrated Circuit Co., Ltd.TriQuint Semiconductor, Inc.Win Semiconductors Corp.Efficient Power Conversion Corp.Dynax Semiconductor, Inc.Transphorm Technology, Inc.SELEX Sistemi Integrati SpAKorea Advanced Nano Fab CenterShanghai Simgui Technology Co., Ltd.Shanghai Simgui Technology Co., Ltd.United Monolithic Semiconductors SASAvogy, Inc.United Silicon Carbide, Inc.Next Generation Power Systems, Inc.Exagan SAGaN Systems, Inc.Scientific Components Corp.
NXP BVAltera Corp.Fujimi, Inc.Axcelis Technologies, Inc.Cymer LLCHuaian Imaging Device Manufacturer Corp.Kawasaki Microelectronics, Inc.Huaian Imaging Device Manufacturer Corp.Harvatek Corp.Xiamen San'an Integrated Circuit Co., Ltd.Jiangyin Changdian Advanced Packaging Co., Ltd.Jiangyin Changdian Advanced Packaging Co., Ltd.Henan YiCheng New Energy Co., Ltd.StarPower Semiconductor Ltd.Dialog Semiconductor Korea, Inc.Timbre Technologies, Inc.Jiangsu Jiejie Microelectronics Co., Ltd.Aminologics Co., Ltd.MTPV Power Corp.FormFactor Beaverton, Inc.R2 Semiconductor, Inc.Crealights Technology Co. Ltd.Suzhou Tongguan Microelectronics Co., Ltd.Visual Photonics Epitaxy Co., Ltd.ChaoLogix, Inc.CustomArray, Inc.ODTech Co., Ltd.Sintronic Technology, Inc.Aeponyx, Inc.Chipworks, Inc.
Fraunhofer-Gesellschaft eVToyota Central R&D Labs, Inc.Semiconductor Components Industries LLCShinko Electric Industries Co., Ltd.Shinko Electric Industries Co., Ltd.Advanced Semiconductor Engineering, Inc.Polaris Innovations Ltd.Dowa Electronics Materials Co., Ltd.Arizona State UniversitySiliconware Precision Industries Co., Ltd.Qimonda AGInternational Rectifier Corp.STATS ChipPAC Pte Ltd.ChipMOS Technologies, Inc.Nuvoton Technology Corp.Powertech Technology, Inc.JCET Group Co., Ltd.eMemory Technology, Inc.Hitachi AIC, Inc.SANYO Semiconductor Co., Ltd.Xintec, Inc.Etron Technology, Inc.Chipbond Technology Corp.Shenzhen Sunlord Electronics Co., Ltd.Amkor Technology, Inc.Princo Corp.NEPES Corp.Xiamen San'an Integrated Circuit Co., Ltd.Camtek Ltd.Xiamen Hongfa Electroacoustic Co., Ltd.