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Daimler-Benz Aerospace AGHarbin Institute of TechnologyHilti AGShimizu Corp.Koenig & Bauer AGKoenig & Bauer AGU.S. Army Corps of EngineersSekisui Kasei Co., Ltd.Shenyang Jianzhu UniversityZhejiang Yasha Decoration Co., Ltd.University of British ColumbiaUACJ Corp.China Construction Seventh Engineering Division Corp. Ltd.Korea Institute of Construction TechnologyXCMG Construction Machinery Co., Ltd.China Construction Seventh Engineering Division Corp. Ltd.Politechnika WroclawskaSumitomo Light Metal Industries Ltd.C.I. Takiron Corp.Sumitomo Light Metal Industries Ltd.Nishikawa Rubber Co., Ltd.Leica Geosystems AGMaeda Corp.Leica Geosystems AGChubu Electric Power Co., Inc.Sinopec Shengli Oilfield Construction Engineering Co. Ltd.Third Construction Engineering Co., Ltd. of China ConstCCCC Second Harbor Engineering Bureau Co. Ltd.Hazama Ando Corp.Okumura Corp.
Deere & Co.Daimler-Benz Aerospace AGFried. Krupp GmbHGebrueder SulzerNippon Steel Nisshin Co., Ltd.Koenig & Bauer AGKoenig & Bauer AGTaiheiyo Cement Corp.Snamprogetti SpAKennametal, Inc.China Construction Eighth Engineering Division Corp. Ltd.China Construction Second Engineering Bureau Co., Ltd.United States Gypsum Co.China Railway Siyuan Survey & Design Group Co., Ltd.United States Gypsum Co.Combustion Engineering, Inc.Primetals Asset Management U.K. Ltd.Saint-Gobain TM KKAlbemarle Corp.Johns Manville Corp.Powerchina Huadong Engineering Corp. Ltd.Powerchina Huadong Engineering Corp. Ltd.Shanghai Baoye Group Co., Ltd.Graco, Inc.China Construction Seventh Engineering Division Corp. Ltd.SMS group GmbHAhlstrom Machinery Corp.Korea Institute of Construction TechnologyThe First Co. of China Eighth Engineering Bureau Ltd.RHI Magnesita Deutschland AG
Samsung Electronics Co., Ltd.LG Electronics, Inc.General Electric Co.Sharp Corp.Seiko Epson Corp.SANYO Electric Co., Ltd.E.I. du Pont de Nemours & Co.EIDP, Inc.Intel Corp.Sumitomo Electric Industries Ltd.Apple, Inc.Brother Industries, Ltd.KYOCERA Chemical Corp.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Toshiba Chemical Corp.Fujifilm Business Innovation Corp.Fuji Electronics Co., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.OppoTaiwan Semiconductor Manufacturing Co., Ltd.Daewoo Electronics Co. Ltd.DAIKIN INDUSTRIES Ltd.Honeywell International, Inc.Kobe Steel, Ltd.Casio Computer Co., Ltd.Midea Group Co. Ltd.Electronics & Telecommunications Research Institute
KYOCERA Chemical Corp.YASKAWA Electric Corp.Fuji Corp. (Felt)Mitsubishi Pencil Co., Ltd.Shin-Etsu Polymer Co., Ltd.Mitsuboshi Belting Ltd.Siemens Nixdorf Informations Systeme AGNisca Corp.Tohoku Ricoh Co LtdMurakami Corp.MegaChips Corp.Allegro MicroSystems LLCChipMOS Technologies, Inc.Uchida Yoko Co., Ltd.Yamato Industry Co., Ltd.IRISO Electronics Co., Ltd.OBIC Co. Ltd.Arai Seisakusho Co., Ltd.Yonyou Network Technology Co., Ltd.Nippon Ceramic Co., Ltd.Delta Electronics (Thailand) Public Co. Ltd.Broadleaf Co., Ltd.Shibaura Electronics Co., Ltd.Intops Co., Ltd.C*Core Technology Co., Ltd.I.S.T Corp.SAMJIN LND Co., Ltd.ASKUL Corp.Astem Co., Ltd.BEI Technologies, Inc.
LG Electronics, Inc.Daikin Airconditioning France SASDAIKIN INDUSTRIES Ltd.Midea Group Co. Ltd.Fujitsu General Ltd.Haier Smart Home Co., Ltd.Carrier Corp.Yanmar Co., Ltd.Azbil Corp.Hanon SystemsHitachi Appliances, Inc.Nippon Seiki Co., Ltd.Hitachi Plant Technologies Ltd.Qingdao Haier Air Conditioning Electronics Co., Ltd.Samsung Gwangju Electronics, Co., Ltd.Qingdao Haier Air Conditioning Electronics Co., Ltd.Behr GmbH & Co. KGGD Midea Heating & Ventilating Equipment Co., Ltd.GD Midea Heating & Ventilating Equipment Co., Ltd.Toshiba Carrier Corp.Toshiba Carrier Corp.Hitachi Air Conditioning Kanto Co., Ltd.Guangdong Galanz Enterprises Co., Ltd.Knorr-Bremse Systeme für Schienenfahrzeuge GmbHChanghong Meiling Co., Ltd.Nippon Chemical Industrial Co., Ltd.TCL Air Conditioner (Zhongshan) Co., Ltd.Maeda Corp.Modine Manufacturing Co.American Standard, Inc.