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Samsung Electronics Co., Ltd.Canon, Inc.International Business Machines Corp.Fujitsu Ltd.General Electric Co.Huawei Technologies Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.Hewlett-Packard Development Co.Eastman Kodak Co.Fujifilm Business Innovation Corp.Google LLCFujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Honeywell International, Inc.Xerox Holdings Corp.Tencent Technology (Shenzhen) Co., Ltd.Alcatel-Lucent S AOlympus Corp.Microsoft Corp.Beijing Xiaomi Mobile Software Co., Ltd.Toyota Industries Corp.Muratec Automation Co., Ltd.Victor Company of Japan Ltd.Victor Company of Japan Ltd.
BOE Technology Group Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.TCL China Star Optoelectronics Technology Co., Ltd.Japan Aviation Electronics Industry Ltd.Chunghwa Picture Tubes Ltd.J.S.T. Manufacturing Co., Ltd.JOLED, Inc.Tianma Microelectronics Co., Ltd.Shenzhen Royole Technologies Co., Ltd.Shenzhen Royole Technologies Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.AVIC Jonhon Optronic Technology Co., Ltd.Kateeva, Inc.FlexEnable Ltd.Advantech Co., Ltd.Yazaki North America, Inc.Souriau SASGennum Corp.Visionox Technology, Inc.Jiangsu Shuangxing Color Plastic New Materials Co., Ltd.Jiangsu Shuangxing Color Plastic New Materials Co., Ltd.ODU GmbH & Co. KGZhuhai Founder PCB Development Co., Ltd.Zhuhai Founder PCB Development Co., Ltd.Changzhou Huawei Advanced Material Co., Ltd.Changzhou Huawei Advanced Material Co., Ltd.WUS Printed Circuit (Kunshan) Co., Ltd.Elma Electronic, Inc.Quellan, Inc.Carlisle Interconnect Technologies, Inc.
Samsung Electronics Co., Ltd.Canon, Inc.LG Electronics, Inc.International Business Machines Corp.Fujitsu Ltd.Sharp Corp.Ricoh Co., Ltd.Ricoh Co., Ltd.Seiko Epson Corp.SANYO Electric Co., Ltd.Intel Corp.ZTE Corp.Apple, Inc.FUJIFILM Corp.BOE Technology Group Co., Ltd.Hewlett-Packard Development Co.Brother Industries, Ltd.Eastman Kodak Co.Boe Innovation Investment Co. Ltd.Fujifilm Business Innovation Corp.Dai Nippon Printing Co., Ltd.Kyocera Corp.Fujifilm Business Innovation Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Xerox Holdings Corp.Semiconductor Energy Laboratory Co., Ltd.Mita Industrial Co., Ltd.Toppan, Inc.Konica Minolta, Inc.
Lite-On IT Corp.Access Co., Ltd.DEXIN Corp.Cirque Corp.Sercomm Corp.Movea SAGenomSys SAAbsolute Software Corp.Canaan Creative Co., Ltd.Innodisk Corp.Cricut, Inc.Red Bend Ltd.Hyperstone GmbHADTEX, Inc.Ivani LLCAxiohm SASLattice Energy Technology Corp.Tera SRLActions Semiconductor Co. Ltd.Magnum Semiconductor, Inc.WFE Technology Corp.Oak Technology, Inc.Teknovus, Inc.Bandspeed, Inc.Imperas, Inc.Cypak ABKilopass Technology, Inc.Jiangsu Eazytec Co., Ltd.Future Dial, Inc.Kudelski SA
Rittal GmbH & Co. KGSTATS ChipPAC Pte Ltd.Anhui Anli Material Technology Co., Ltd.Promerus LLCRogers Germany GmbHOrient Semiconductor Electronics Ltd.Taiwan Hon Chuan Enterprise Co., Ltd.Taiwan Hon Chuan Enterprise Co., Ltd.Nano Terra, Inc.Elma Electronic, Inc.Jiangsu HHCK Advanced Materials Co., Ltd.Vector Foiltec GmbHLaird Durham, Inc.Souriau PA&E, Inc.Applied Microtech SAMSG Lithoglas GmbHOM Group, Inc.DeMaria ElectroOptics Systems, Inc.Dordan Manufacturing Co.Mektron Systems Ltd.Quantum Leap Packaging, Inc.Hartmann Elektronic GmbHSCHOTT North America, Inc.
Huawei Technologies Co., Ltd.Oki Electric Industry Co., Ltd.Hangzhou H3C Technologies Co., Ltd.Juniper Networks, Inc.Sagemcom Broadband SASSagemcom Broadband SASRazer (Asia-Pacific) Pte. Ltd.Razer (Asia-Pacific) Pte. Ltd.igus GmbHFujian Star-Net Communication Co., Ltd.Maipu Communication Technology Co., Ltd.Maipu Communication Technology Co., Ltd.General Cable Technologies Corp.TP-LINK Technologies Co., Ltd.Arista Networks, Inc.ACCO Brands Corp.Tomra Systems ASATomra Systems ASAShenzhen Han's CNC Technology Co., Ltd.Allied Telesis Holdings K.K.Shenzhen Han's CNC Technology Co., Ltd.D-Link Corp.Kunshan Q Technology Co., Ltd.NETGEAR, Inc.Raisecom Technology Co., Ltd.Fibocom Wireless, Inc.Cognitive Systems Corp.Bouygues Telecom SAAlpha Networks, Inc.Enterasys Networks, Inc.
LG Electronics, Inc.Sharp Corp.Huawei Technologies Co., Ltd.Ericsson, Inc.Nippon Telegraph & Telephone Corp.ZTE Corp.Kyocera Corp.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Guangdong OPPO Mobile Telecommunications Corp., Ltd.Electronics & Telecommunications Research InstituteAlcatel-Lucent S ANTT DOCOMO, Inc.Showa Denko Materials Co. Ltd.Western Electric Co., Inc.Fujikura Ltd.Hitachi Metals, Ltd.Proterial Ltd.vivo Mobile Communication Co., Ltd.Nokia Siemens Networks OyLucent Technologies, Inc.China Mobile Communications Group Co., Ltd.China Mobile Communications Group Co., Ltd.telent Ltd.Mannesmann AGJapan Aviation Electronics Industry Ltd.SK Telecom Co., Ltd.BlackBerry Ltd.Motorola Solutions, Inc.Tokyo Electric Power Co. Holdings, Inc.Nubia Technology Co., Ltd.
